Rolling, slitting and dimensional control
Table of Contents
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent metallurgical connection, ensuring stable reliability compared to electroplating. This enables excellent weldability, designed to resist peeling during bending, and stable performance under thermal cycling conditions.
What is Copper Clad Aluminum Ribbon Wire?
Copper Clad Aluminum Ribbon Wire is a Copper Clad Aluminum (Cu/Al) material with conductivity confirmed by copper ratio and specification, , widely used in Electronics Connectors, Industrial Motors, and other applications. It combines the characteristics of multiple metals; whether it can replace a single-metal material must be validated for the target application.
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Copper Clad Aluminum Ribbon Wire
RAYTRON Copper Clad Aluminum Ribbon Wire is manufactured using the Clad & Weld process with a metallurgically bonded copper-aluminum interface. Conductivity depends on the copper ratio and purchase specification; confirm the applicable grade and measured values per lot in your RFQ. Calculated by rule of mixtures, composite density is about 3.3–3.6 g/cm³ at 10–15% copper by volume (calculated, not measured), giving lower weight than copper at equal geometry. Suitable for precision electronic components, sensors, miniature motors and high-fidelity speaker voice coils, with dimensional tolerance of ±0.003mm; safety-critical uses require project-level evaluation and customer-led validation. Ribbon wire uses project-specific specifications and agreed test methods.
Material
Copper Clad Aluminum (Cu/Al)
Conductivity
Confirm by copper ratio and specification
Tensile Strength
165 MPa
Dimensions
Applications
Evaluating CCA for your application? See the CCA Application Selection and Validation Guide for suitability boundaries, validation routes and the RFQ checklist.
Detailed Specifications
| Specification | Value |
|---|---|
| Size Range | Width: 0.2–2.0 mm, Thickness: 0.05–0.5 mm |
| Copper Layer Ratio | Confirm by grade and purchase specification |
| Density | 3.3 g/cm³ |
| Bond Strength | Per control plan |
| Standards | Project-specific specification and agreed test methods |
| Temper | Soft (O), Half Hard (H) |
| Dimensional Tolerance | ±0.003mm |
| Post-Processing | Bare, Tin-plated, Enamel |
Standards & Compliance
Applicable Standards
Certifications
Typical Markets
Regional Compliance Note
We can provide product certification documents that meet local regulatory requirements based on your target market.
Frequently Asked Questions
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Success Story
A manufacturer transformed their production with our high-quality materials.
- Improved efficiency and productivity
- Cost reduction and savings
- Enhanced product quality
Real-world application in industrial setting