Raytron at SNEC PV+ 2026: Composite PV Ribbon

Conductor and cell design

The ribbon combines a copper-aluminum conductor with a solderable surface selected for the joining process. State the core, copper fraction basis, round diameter or flat width/thickness, coating and mechanical condition.

Cell metallization, contact layout and stringer conditions determine the candidate geometry and coating. Compare shading and resistance together, then check coating wetting, peel behavior and cell damage under the actual process.

What to compare in the trial

• Geometry: thickness, width or diameter, tolerance, roundness, flatness, camber and winding quality;
• Electrical performance: resistance per unit length, conductivity, series loss, module power impact and hot-spot risk;
• Soldering: solder-layer thickness and uniformity, wetting, stringing temperature, flux, speed, peel force and joint consistency;
• Mechanical compatibility: tensile properties, elongation, yield behavior, repeated bending, post-solder stress, cell bow and breakage risk;
• Equipment compatibility: payoff, tension, straightening, soldering head, vision system, cycle time and unplanned stops;
• Reliability: thermal cycling, damp heat, mechanical load, potential-induced degradation, corrosion and long-term power stability;
• Economics: material savings, process investment, yield change and qualification cost per meter, cell, module and gigawatt.

Inputs for a sample review

• Cell technology: TOPCon, HJT, BC or another platform; cell size, slicing strategy and busbar layout;
• Current ribbon type, dimensions, tolerances, temper, solder alloy and coating thickness;
• Target resistance per unit length, module power or copper-reduction/cost target per GW;
• Stringer model, line speed, soldering temperature, flux, tension and peel-force standard;
• Module layout, series-parallel configuration, operating current and reliability requirements;
• Sample quantity, validation timing and expected annual volume or production capacity.

Check the production settings

Evaluate payoff tension, guides, soldering temperature/profile, head configuration, speed, vision settings and quality criteria on the intended line. Record required adjustments and the resulting feeding, yield and joint data before approving the changed process.