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2026 ANNUAL OVERVIEW

Raytron’s 2026 Event Archive

This archive covers four 2026 industry events on precision conductors, photovoltaic ribbon and clad materials. They are wire 2026 Düsseldorf in April, SNEC PV+ in Shanghai in June, the Copper Composite Materials Developer Forum in Ningbo in August, and wire China 2026 in Shanghai in September.

Raytron industry events theme visual

The wire Düsseldorf, SNEC and CCD pages record Raytron presentations and engineering topics. The wire China page retains its original plan with attendance unconfirmed.

Raytron invitation visual for wire China 2026, Hall E1, Booth E1F23
Event Archive September 21-24, 2026

wire China 2026: Clad Conductor Information

The September event dates have passed. This page retains Raytron’s exhibition plan; attendance has not been confirmed. Send a current conductor drawing or process question for follow-up.

Hall E1, Booth E1F23 View details
Raytron exhibition area at the 2026 Copper Composite Materials Developer Forum
Completed August 24-26, 2026 (registration on August 24; main program on August 25-26)

Raytron at CCD2026: CCA Wire, Strip and Foil

Raytron’s CCD2026 presentation covered CCA round and flat wire, fully clad strip and precision foil. Follow-up discussions focus on dimensions, surface condition and joining requirements for each application.

Company Exhibition Area View details
Raytron booth and exhibits at SNEC PV+ 2026 in Shanghai
Completed June 3-5, 2026

Raytron at SNEC PV+ 2026: Composite PV Ribbon

Raytron presented copper–aluminum composite ribbon concepts for multi-busbar and back-contact modules. Follow-up work compares resistance, soldering, line performance and module reliability with the current ribbon.

Hall 2.2, Booth B130 View details
Raytron booth and team at wire 2026 Düsseldorf
Completed April 13-17, 2026

Raytron at wire 2026 Düsseldorf

Raytron presented clad conductor structures in round wire, flat wire, strip and foil. Follow-up reviews define the electrical duty, dimensions, joining and test plan for each application.

Next Step

Choose an event to review the details. For a technical discussion, send your current conductor or ribbon specification and application requirements. Include the electrical, thermal, mechanical, processing, joining and environmental conditions.

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