PV Ribbon for Solar Module Interconnection
Raytron supplies interconnect, busbar, BC, SMBB/0BB and low-temperature ribbon, plus RAYLITE copper-aluminum composite ribbon. Select the ribbon by its role in the module and its compatibility with the cell and stringing process.
Product Portfolio
Enter the Right Product Path by Cell Technology and Process
Interconnect, busbar, BC, SMBB, 0BB, low-temperature, round ribbon and RAYLITE composite each have a dedicated path for module-maker RFQs.
Interconnect Ribbon / Tabbing Wire
Solar tabbing ribbon for cell stringing and solar module interconnection.
Busbar Ribbon
Busbar ribbon for module current collection, junction box connection and high-current paths.
BC Ribbon
Custom ribbon for back-contact solar cells and high-efficiency module layouts.
SMBB Ribbon
PV ribbon for multi-busbar and super multi-busbar cells where thin, low-stress conductors are required.
0BB Ribbon
Zero-busbar PV ribbon requiring stringer, EL and reliability validation.
RAYLITE Composite PV Ribbon
Copper-aluminum PV ribbon for copper-saving, cost-control and lightweight module validation.
Round Solar Ribbon
Round solar ribbon for PV interconnection designs requiring round conductor geometry and copper-saving review.
Product Selection Matrix
Selection and Validation Focus for Six Ribbon Types
Unconfirmed values are shown as “Project-specific; confirm with Raytron engineering.” — never as fixed numbers in place of project validation.
| Product | Base material | Geometry | Coating system | Typical module/process | Key validation |
|---|---|---|---|---|---|
| Interconnect ribbon | Approved copper or composite system | Project-specific; confirm with Raytron engineering. | Tin/lead-free/customer system | PERC/TOPCon/HJT | resistance, solderability, peel |
| Busbar ribbon | Approved copper or composite system | Project-specific; confirm with Raytron engineering. | Project-specific; confirm with Raytron engineering. | Busbar collection | resistance, coating, camber |
| BC ribbon | Project-specific; confirm with Raytron engineering. | Project-specific; confirm with Raytron engineering. | Project-specific; confirm with Raytron engineering. | BC/HPBC | stringer and module process |
| SMBB/0BB | Project-specific; confirm with Raytron engineering. | Project-specific; confirm with Raytron engineering. | Project-specific; confirm with Raytron engineering. | Dense interconnection | stringer compatibility |
| Low-temperature ribbon | Approved base | Project-specific; confirm with Raytron engineering. | Bi-Sn family or approved system | HJT/thin wafer | soldering window, fatigue |
| RAYLITE | Copper-aluminum composite | Flat/ribbon/busbar | Project-specific solder coating | Copper-saving qualification | resistance, peel, TC, DH, EL |
Differentiation
RAYLITE Copper-Aluminum Composite PV Ribbon
RAYLITE is Raytron’s copper-aluminum composite PV ribbon platform for module manufacturers evaluating copper reduction, conductor mass and module-level cost optimization.
RAYLITE is not a universal drop-in replacement for pure copper ribbon. Qualification must consider cell technology, ribbon geometry, solder coating, stringer equipment, soldering window, electrical resistance and module reliability requirements.
Evaluation Goals
- Copper reduction: lower copper volume usage
- Conductor mass: reduce ribbon weight
- Module-level cost optimization: qualified per project
Qualification Boundary
- Resistance and module power impact must be validated before substitution
- Coating matched to soldering window
- Module reliability (TC / DH / EL) must pass first
Important Notice
Must not be represented as “maintains same performance as copper”. Final suitability must be validated by the customer under actual module process conditions.
RAYLITE product pageSpecification and Mechanical Requirements
PV Ribbon Types and Typical Specifications
Typical ranges are shown below. Final specifications depend on the base material system, coating and purchase specification. Mechanical requirements (yield strength, elongation, camber) are confirmed per project target and batch control plan.
| Product Type | Typical Width | Typical Thickness | Base Material | Coating | Cell / Module Use | Validation Items |
|---|---|---|---|---|---|---|
| Interconnect Ribbon | 0.3–2.0 mm | 0.10–0.35 mm | Copper / Composite | Sn / SnPb / lead-free | PERC / TOPCon / HJT | solderability, peel, resistance |
| Busbar Ribbon | 2.0–6.0 mm | 0.15–0.40 mm | Copper / Composite | Sn / lead-free | Module busbar | resistance, coating, camber |
| BC Ribbon | Project-specific; confirm with Raytron engineering. | Project-specific; confirm with Raytron engineering. | Copper / Composite | Customized | BC / HPBC modules | process compatibility |
| SMBB / 0BB Ribbon | Project-specific; confirm with Raytron engineering. | Project-specific; confirm with Raytron engineering. | Copper / Composite | Customized | High-density interconnection | stringer validation |
| Low-Temperature Ribbon | Project-specific; confirm with Raytron engineering. | Project-specific; confirm with Raytron engineering. | Approved base | Bi-Sn family or approved system | HJT / thin wafer | soldering window, fatigue |
| RAYLITE Composite PV Ribbon | Project-specific; confirm with Raytron engineering. | Project-specific; confirm with Raytron engineering. | Cu-Al composite | Project-specific solder coating | Copper-saving validation | TC, DH, EL, peel, resistance |
* Project-specific specifications must be confirmed with Raytron engineering; do not assume values without confirmation.
Process Compatibility
Cell Technology and Process Compatibility
Ribbon selection must be confirmed together with cell technology and stringing process: coating matched to process temperature, yield strength and bow control for thin cells, spool format matched to the stringer.
PERC / TOPCon
Standard tin-family coating and stringing temperature window; confirm coating thickness and target peel strength.
HJT /
Low-temperature ribbon (Bi-Sn family or approved system); focus on soldering window, thermal stress and fatigue.
BC / HPBC
Geometry and coating customized to module layout; joint validation with stringer and module process required.
SMBB / 0BB
Thin, low-stress conductors; confirm spool format and stringer compatibility.
Validation Requirements
Validation Path Before Volume Production
Applies to all ribbon types (including RAYLITE composite). Complete the following at module level before volume production:
- Electrical resistance
- Coating thickness
- Solderability
- Peel strength
- Camber and straightness
- Thermal cycling
- Damp heat
- EL inspection before and after reliability testing
Quality Control Items
Agree the inspection items, methods, sampling frequency and acceptance limits for the purchase specification.
| Test Item | Method | Frequency |
|---|---|---|
| Dimensions (width × thickness) | Optical micrometer / laser gauge | Agree in the inspection plan |
| Coating thickness (tinned) | X-ray fluorescence (XRF) | Agree in the inspection plan |
| Yield strength | Universal testing machine | Agree in the inspection plan |
| Elongation | Universal testing machine | Agree in the inspection plan |
| Solderability | Wetting balance test | Agree in the inspection plan |
| Camber | Straight-edge measurement | Agree in the inspection plan |
| Surface quality | Visual inspection + optical | Agree in the inspection plan |
| Bond strength (composite) | Peel test | Agree in the inspection plan |
RFQ
Send These Details for a Faster Actionable Quote
Provide each item once. Raytron engineering reviews against cell technology, geometry, coating and reliability targets before replying.
- Cell technology and module type (PERC / TOPCon / HJT / BC / SMBB / 0BB)
- Ribbon geometry: width × thickness (or drawing)
- Coating system and target thickness
- Mechanical targets: yield strength, elongation, camber
- Spool / supply format and stringer model
- Annual volume and target application