Raytron Technical Review RESEARCH ARTICLE
Thermal Cycling Performance of CCA Conductors
Received: 2025-12 Accepted: 2026-02 Published: 03/2026
DOI: 10.1234/raytron.2026.WP-02-13
1. Introduction
1.1 Practical Thermal Cycling
1.2 Bimetallic Concerns
Diagram placeholder
MEDIA TODO2. Thermal Expansion Effects
2.1 Stress Development
σ = E_eff × Δα × ΔT
(1) Diagram placeholder
MEDIA TODO3. Interface Behavior
4. Mechanical Property Changes
5. Testing Methods
6. Conclusion
CCA performs well under normal thermal cycling conditions, with metallurgical bonding ensuring interface stability.
Figures
HotExpansionPoorDifferenceDiagram
Create Interface Stress vs Temperature Variation Diagram
Tables
Table 1 Practical Thermal Cycling Conditions
| Application | Temperature Range | Cycles/Year |
|---|---|---|
| Entry outside Wiring | -20to+60°C | 365+ |
| Automotive | -40to+125°C | 1000+ |
| Industrial | 20to+80°C | 200+ |
| CapacityPV | -20to+90°C | 365+ |
Table 2 Thermal Expansion Coefficient Difference
| Material | CTE (×10⁻⁶/°C) |
|---|---|
| Copper | 17 |
| Aluminum | 23 |
| PoorDifference | 35% |
Table 3 Interface Stress Estimation
| Temperature Change | Estimated Interface Stress |
|---|---|
| 50°C | 30-40 MPa |
| 100°C | 60-80 MPa |
| 150°C | 90-120 MPa |
Table 4 Testing Standards
| Standard | Cycling Conditions | Acceptance Criteria |
|---|---|---|
| ASTM B566 | -40to+85°C, 100Cycle | No Delamination |
| IEC 62602 | -40to+125°C, 50Cycle | Resistance Variation<5% |
References
- ASTM B566: Copper-Clad Aluminum Wire ASTM (2020)
- IEC 62602: Copper-clad aluminum IEC (2022)