Raytron Technical Review RESEARCH ARTICLE
Thermal Cycling Performance of CCA Conductors
Received: 2025年12月 Accepted: 2026年2月 Published: 2026年3月
DOI: 10.1234/raytron.2026.WP-02-13
1. Introduction
1.1 Practical Thermal Cycling
1.2 Bimetallic Concerns
创建热膨胀差异示意图
MEDIA TODO2. Thermal Expansion Effects
2.1 Stress Development
σ = E_eff × Δα × ΔT
(1) 创建界面应力随温度变化图
MEDIA TODO3. Interface Behavior
4. Mechanical Property Changes
5. Testing Methods
6. Conclusion
CCA performs well under normal thermal cycling conditions, with metallurgical bonding ensuring interface stability.
Figures
创建热膨胀差异示意图
创建界面应力随温度变化图
Tables
Table 1 Practical Thermal Cycling Conditions
| Application | Temperature Range | Cycles/Year |
|---|---|---|
| 户外布线 | -20至+60°C | 365+ |
| 汽车 | -40至+125°C | 1000+ |
| 工业 | 20至+80°C | 200+ |
| 太阳能PV | -20至+90°C | 365+ |
Table 2 Thermal Expansion Coefficient Difference
| Material | CTE (×10⁻⁶/°C) |
|---|---|
| 铜 | 17 |
| 铝 | 23 |
| 差异 | 35% |
Table 3 Interface Stress Estimation
| Temperature Change | Estimated Interface Stress |
|---|---|
| 50°C | 30-40 MPa |
| 100°C | 60-80 MPa |
| 150°C | 90-120 MPa |
Table 4 Testing Standards
| Standard | Cycling Conditions | Acceptance Criteria |
|---|---|---|
| ASTM B566 | -40至+85°C, 100循环 | 无分层 |
| IEC 62602 | -40至+125°C, 50循环 | 电阻变化<5% |
References
- ASTM B566: Copper-Clad Aluminum Wire ASTM (2020)
- IEC 62602: Copper-clad aluminum IEC (2022)