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Last Updated: March 2, 2026 Recently Updated

PV Ribbon Selection Guide

By Solar Cell Technology

Select the optimal ribbon specifications based on your cell technology to ensure best soldering quality and module efficiency. CCA alternatives available for all specifications.

Cell Type Recommended Specifications Action
PERC Passivated Emitter Rear Cell

Mainstream technology with highest market share, mature and stable process

Standard PV Ribbon
Thickness: 0.28-0.35mm
Width: 0.8-2.0mm
Coating: Sn60Pb40 or Sn100 coating
Yield Strength: <70 MPa
Conductivity: ≥85% IACS
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TOPCon Tunnel Oxide Passivated Contact

Next-gen high-efficiency technology, conversion efficiency exceeds 25%

MBB Ultra-thin Ribbon
Thickness: 0.24-0.26mm
Width: 0.3-0.8mm
Coating: Low-temp solder coating
Yield Strength: <50 MPa
Conductivity: ≥90% IACS
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HJT Heterojunction Technology

Ultra-high efficiency technology, bifacial generation, excellent temperature coefficient

Low-Temperature Ribbon
Thickness: 0.15-0.25mm
Width: 0.5-1.2mm
Coating: Low-temp solder (<180°C)
Yield Strength: <60 MPa
Conductivity: ≥88% IACS
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BC (IBC) Back Contact / Interdigitated Back Contact

Front busbar-free design, aesthetic and efficient, for premium market

Reflective Ribbon
Thickness: 0.10-0.25mm
Width: Customizable width
Coating: Reflective coating optional
Yield Strength: <55 MPa
Conductivity: ≥85% IACS
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CCA Alternative Option

Available for all cell technology types

  • 20-30% cost saving vs pure copper
  • Conductivity ≥62% IACS
  • 40% weight reduction, lower shipping costs
  • Compliant with ASTM B566 standard

Frequently Asked Questions

How to choose the right PV ribbon thickness?
Thickness depends on cell type: PERC standard 0.2-0.35mm, TOPCon ultra-thin <0.1mm, HJT low-temp 0.15-0.25mm, BC custom 0.12-0.2mm. Thinner ribbons reduce shading but require higher soldering precision.
What is the difference between CCA and pure copper ribbon?
CCA (Copper Clad Aluminum) ribbon has an aluminum core with copper outer layer, achieving 62%+ IACS conductivity, 40% weight reduction, and 20-30% cost savings. Suitable for cost-sensitive applications with moderate conductivity requirements.
Why does HJT require low-temperature ribbon?
HJT cells use amorphous silicon passivation layers sensitive to temperature. Temperatures above 200°C can damage the amorphous silicon layer and reduce cell efficiency. Low-temperature ribbon (<180°C soldering) protects cell structure for long-term reliability.

Need Technical Support?

Our engineering team can provide customized ribbon solutions based on your specific cell specifications and module design.

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